Tiománaithe ag AITHEANTAIS nó ainm an gléas

Feistí Aitheanta:165022367

An ceann deireanach ar a dtugtar tiománaí: 23.12.2020

Ad

Новости devid.info

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) presupposes that chip contacts will be soldered directly to the motherboard. This way, the customer won't be able to change the chip to the other one manually.

Currently, BGA solution is employed merely in all-in-one computers, laptops, ultrabooks, and mobile devices. Its main advantage is seen in the physical reduction of taken space that is a vital point for compact devices. It goes without saying, that its main disadvantage is seen in the impossibility to upgrade the chip for a more efficient one, since its installation will be realized only in factory conditions.

Intel does not comment on such rumors so far. Nevertheless, a few OEM adjusters confirm that Broadwell CPUs will be delivered particularly in BGA casings.
  • 0
  • 30 November 2012, 17:43
Only registered users can comment.