Thermaltake has recently released the Versa H17 Chassis, shown at the CES 2018 event. The novelty is one of the most affordable Taiwan vendor’s offers, which can be used for powerful gaming systems and workstations assembling.

 

Apart from the basic Thermaltake Versa H17 (CA-1J1-00S1NN-00) version, the manufacturer also is ready to produce models with the acrylic window in the side panel, named Versa H17 Window (CA-1J1-00S1WN-00). The cases weigh 4.5 kg. The dimensions are 380 x 390 x 205 mm.

 

The chassis is mostly made of the 0.6 mm SPCC steel. The front and the upper panels possess netted inserts. The I/O panel includes jacks for a mic and headphones, alongside with the Reset and Power buttons, one USB 3.0 and two USB 2.0 ports.

 

The framework inner space is divided into two sections. The upper part is able to hold the Micro-ATX/Mini-ITX motherboard, a pair of two-slot 350 mm graphics cards, two 2.5-inch …

ECS proudly introduces a series of new motherboards, based on Intel H81 Express chipset. The series consists of three models (H81H3-A3, H81H3-M7, H81H3-I) that support Socket LGA1150 platform and are ready to work with Intel Haswell processors. All three products are developed in different form-factors: standard ATX, microATX and mini-ITX. Therefore, the users have got a chance to choose which item is more appropriate for the assembling of systems with various performance requirements.



Despite the fact that the new-comers position themselves as entry-level solutions, ECS has taken care of their reliability and stability of operation. Therein, it incorporated Durathon technology, which is responsible for the products’ eligible work during a long period of time. Durathon implies the employment of a PCB with high density in order to protect the components from the detrimental effect of moisture, the replacement of standard capacitors to solid-state analogues with prolonged …

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …