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ドライバの名前 | OPL3-SAx Plug and Play(Italian) |
ファイル名 | 419604_smo2l1us.exe |
供应商 | YAMAHA Corporation |
驱动型 | MEDIA |
サイズ | 607 Kb |
版本 | |
驱动程序日期 | |
操作系统 | |
上传 | 2018-02-16 |
Or click to install driver manually | |
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The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.
The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …