Company Biostar, taking the example of the motherboard market leaders, manufactures the product for the audiophile — Biostar Hi-Fi Z77X. In the latest model are involved: the processor socket LGA1155, the flagship chipset for the platform (Intel Z77), three full-height PCI Express x16 and 13-channel subsystem of CPU power. The developer promises high quality audio through 7.1-channel HD Blue-ray audio codec ALC898, Technology THX TruStudio Pro, Hi-Fi Ground (multi-layer PCB with protectors properties), and Puro Tone (signal / noise ratio — 110 dB), as well as resistors, Hi-Fi Resistor with tin oxide capacitors and Hi-Fi Cap.
Xigmatek, a Taiwanese manufacturer of PC cooling solutions, has just promulgated the specifications of its new cooler series entitled Apache III. The series consists of two models only, which differentiate themselves by the casing's material and color. Model CD901 is housed in a silver aluminum casing, while model CD903 – in a black anodized aluminum casing. Both models have been developed specifically for CPU cooling purposes; they are able to support various platforms offered by Intel and AMD: LGA 775, 1155, 1156 (Intel), Socket AM2 and later (AMD).|
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| Driver name | DELL 1x3 Backplane |
| File name | 272934_R930_Drivers-for-OS-Deployment_Application_KYM9N_WN32_15.04.10_A00.EXE |
| Vendor | Dell |
| Driver type | SYSTEM |
| Size | 79.9 Mb |
| Version | 5.0 |
| Driver Date | 2009-05-12 |
| Operating system | |
| Upload | 2017-04-11 |
| Or click to install driver manually | |
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Chassis with futuristic design are not novelty for the exacting consumers, but the demand for such products never slumps. In this light, practically every company that specializes on computer hardware tries to replenish its line of chassis with an item of unusual design and prominent technical characteristics. In the majority of cases, such products belong to the high-end category and cost pretty penny. Thermaltake chassis collection boasts a line of high-end products, among which is Level 10 GT model. This model is characterized by refined and stylish design, as well as, multiple facilities pertained to layout and performance. Design
Chassis Thermaltake Level 10 GT is developed in Full-Tower form-factor and goes with 582x282x590 dimensions. The frame and plates are made of steel, while the ornamental elements – of plastic. The casing has got external section divisions which are realized by means of the overhung details and different coloring. Upon the whole, this model …
