The Samsung Co. presented the latest C34H890 monitor, suitable for multitask systems.



The novelty possesses a VA matrix. This 34'' curved screen features the 3440 × 1440 pixels resolution and the 21:9 aspect ratio. The response time is equal to 4 ms, and viewing angles are 178 degrees. The product also ensures 300 cd/m2 brightness, 3000:1 contrast and 99.5 % of sRGB colour gamut coverage.


The AMD FreeSync solution ensures the frame rate synchronization process. Picture-By-Picture, Picture-In-Picture, as well as Flicker Free technologies are supported.


Connectivity options include a USB 3.0 hub (plus a symmetrical USB Type-C port), DisplayPort and HDMI interfaces, alongside with a standard 3.5 mm audio jack. The stand allows to customize inclination and display turning angles and modify its height in relation to a desk surface.


The price and market launch date of Samsung C34H890 are unknown yet.

Introduction

Now all the motherboards for the processors Coffee Lake are based on the Intel Z370. When assembling a new PC with 8-generation Core chips, you need to choose one of the models on the top-end chipset. In the five months since the announcement of the new platform, manufacturers have prepared many devices with different functionality, equipment and their unique features. Today in the focus of our attention is a full-format model with a militant, but concise title - MSI Z370 TOMAHAWK.


Packaging

The box includes a user's manual, a driver and software CD, installation instructions, a rear panel cover, a pair of SATA interface cables, and an extension cable for connecting an external RGB tape.


Design

MSI Z370 TOMAHAWK corresponds to the ATX format and has a size of 304 × 243 mm. On the black printed circuit board there is white decoration. Elements of the cooling system, as well as a plastic protective casing in the interface panel area are made …

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …