SoC Intel Gemini Lake products, Cannon Lake processors, as well as Intel 300-series chipsets for desktop Coffee Lake CPUs will get builtin CNVi (Connectivity Integration) modules. It’s already clear, that these modules will contribute to Intel platforms wireless connectivity in Wi-Fi and Bluetooth networks.



CNVi obtains the Wi-Fi 802.11ac (and lower) MAC media access controller, MAC Bluetooth 5 controller and the wideband Bluetooth 5 modem. Radio-frequency Wi-Fi and WiGig components will stay as the discrete CRF (Companion RF) interface with a wideband Wi-Fi/WiGig modem and necessary high-frequency circuits/filters.


At present, the SoC/CPU/south bridge hold several wireless platform parts, which saves costs, simplifies design and solutions developing. However, the Intel company suggests using the CNVio interface and Wireless AC 9560 modules (available in M.2 2230 and M.2 1216 form factors) of its own making instead of PCIe and USB. We doubt whether it’ll be possible to …

The Swiftech Company releases innovative Apogee SKF Heirloom waterblocks, compatible with all modern central processors and aimed at users paying extra attention to PC’s components layout. The unit utilizes the latest cooling system, performed out of 125 micron thick fins.



There are five colour versions of this product available. Moreover, upon purchase one can select among six cover plates and two types (black and chrome-plated) of mounting brackets. Two lines of RGB LED lights are embedded into this waterblock, thus, making it fit any colour scheme.


The base of the Swiftech novelty is produced out of copper, and the upper part – out of anodized aluminium. In the middle, there is a transparent acrylic window.


Apogee SKF Heirloom waterblocks cost approximately $95. The supply set contains one element, framing the window, as well as one piece in the shape of the company’s logo. To make a waterblock unique the manufacturer is ready to engrave any text (not more …

Elsa Technology has announced the future release of its alternative version of graphics adapter Nvidia GeForce GTX 670. The new model is developed according to 28 nm technological process and employs GK104 chip with 1344 CUDA cores. It also boasts the implementation of advanced architecture, called Kepler. The major distinction of Elsa GeForce GTX 670 from its reference models is the integration of Silent Air Cooling technology (SAC).



This model is based on blue circuit board destined for PCI Express 3.0 x16 bus. Elsa graphics card is equipped with GDDR5 memory type (256 bit interface) and has got 2048 Mb of overall volume capacity. The backplate is assigned for a couple of DVI ports, a single HDMI, and one DisplayPort 1.2 port. This graphics adapter is compatible with DirectX 11 and employs Nvidia FXAA and Nvidia TXAA technologies for the improvement of imaging. It also supports Adaptive Vsync mode for more smooth games playback, as well as, Nvidia SLI, Nvidia 3D Vision, Nvidia …