The Thermalright company has commercialized the ARO-M14 cooling system, designed for AMD Ryzen processors. The novelty got the shape of a standard tower cooler. It’s available in two versions differing in colour of the upper plate of a heatsink. The manufacturer claims, its product is able to disseminate up to 240 W of heat output.

 

The Thermalright ARO-M14 heatsink with the 140 x 115 x 162 mm dimensions weighs 720 g. The system features the copper nickel-plated base, six copper heat pipes (6 mm in diameter) and an array of aluminium fins.

 

The supply kit contains a 140 mm TY-147 fan, operating at the 300–1,300 rpm velocity. The propeller produces up to 73.6 CFM (125 m³/h) airflow at the ultimate 21 dBA noise level. The list of processing platforms supported includes AMD AM4 only.

 

One may purchase Thermalright ARO-M14 in many European stores for about €50.

The much-talked about graphical technology from AMD – FreeSync – is already out. Its privileges over rival solutions might be seen from different angles. To begin with, it dramatically optimizes the gameplay by improving image smoothness, reducing lag time, and eliminating splitting. FreeSync enables the synchronization of screen refresh time with GPU refresh time in real time; hence, images are updated only when the graphical adapter shapes the frame.



To continue, AMD FreeSync, is an open standard which does not require calculations, since it is integrated within an updated DisplayPort 1.2a interface. As distinct from Nvidia’s G-Sync, there is no need to equip the monitor with a dedicated module. Moreover, this technology supports the widest refresh range: 9-240 Hz; therefore, monitors manufacturers receive a tool for a standalone definition of operational limits for a particular model.


Currently, FreeSync is implemented within six graphics adapters and within …

The Sapphire Co. is a well-known supplier of baseboards for AMD CPUs, but the novelty from this vendor,


BP-FT3bGS, is distinguished due to the fact that it doesn’t support processors mounting. Instead the


manufacturer locates a G-line AMD SoC on it beforehand. Supposedly, it’s a GX-210KL or a GX-210HL


SoC with the 4.5 or 7 W TDP respectively. The difference lies in the DDR3-1333/DDR3-1066 memory


module support by a controller, as well as in the operating temperature range, which is 0–90°C/-


40–105°C).


Sapphire BP-FT3bGS is not big, 100 х 100 mm only, because the SoC is placed on the back side of the


board, where one can also find a radiator cooling system with two heat pipes. The specialty is meant to


be embedded into those devices, which earlier could operate AMD Geode based cards.


Two SODIMM slots can incorporate up to 16 GB of DDR3 RAM. The drive is linked to the mSATA port. A


mini PCI-e slot, two HDMI video …