The German Watercool Co. has released a special water block version. The specialty, called Heatkiller IV PRO for Threadripper, is aimed at AMD Ryzen Threadripper processors and has larger dimensions and weight, than a basic model. At present this product is available in 4 versions.
The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.
SilentiumPC, a comparatively ‘fresh’ player in the cooling market, has recently introduced a new CPU cooler for budget-oriented customers. Codenamed Fortis 2 XE1226, it features 130x95x155 mm dimensions and weighs 880 g. It is intended to support the majority of modern platforms, including Intel LGA 775/1366/2011/115x and AMD FM1/FM2/AM2/AM2+/AM3/AM3+.
HSP56 WDM DEVICE (ALI MR)
PCI\VEN_1002&DEV_434D
HSP56 WDM DEVICE (ALI+ MR)
PCI\VEN_1039&DEV_7013
HSP56 WDM DEVICE (ATI MR)
PCI\VEN_10B9&DEV_5450
HSP56 WDM DEVICE (Conexant PCI)
PCI\VEN_10B9&DEV_5450&SUBSYS_00011179
HSP56 WDM DEVICE (Intel MR)
PCI\VEN_10B9&DEV_5450&SUBSYS_4C215349
HSP56 WDM DEVICE (NVidia MR)
PCI\VEN_10B9&DEV_5450&SUBSYS_545110B9
HSP56 WDM DEVICE (Realtek MR)
PCI\VEN_10B9&DEV_5457
HSP56 WDM DEVICE (SIS MR)
PCI\VEN_10DE&DEV_0069
HSP56 WDM DEVICE (VIA MR)
PCI\VEN_10DE&DEV_00D9
PCI\VEN_1002&DEV_434D
HSP56 WDM DEVICE (ALI+ MR)
PCI\VEN_1039&DEV_7013
HSP56 WDM DEVICE (ATI MR)
PCI\VEN_10B9&DEV_5450
HSP56 WDM DEVICE (Conexant PCI)
PCI\VEN_10B9&DEV_5450&SUBSYS_00011179
HSP56 WDM DEVICE (Intel MR)
PCI\VEN_10B9&DEV_5450&SUBSYS_4C215349
HSP56 WDM DEVICE (NVidia MR)
PCI\VEN_10B9&DEV_5450&SUBSYS_545110B9
HSP56 WDM DEVICE (Realtek MR)
PCI\VEN_10B9&DEV_5457
HSP56 WDM DEVICE (SIS MR)
PCI\VEN_10DE&DEV_0069
HSP56 WDM DEVICE (VIA MR)
PCI\VEN_10DE&DEV_00D9