ASUS ENGTX560 Ti DC/2DI/1GD5 model does not belong to the category of the best among the GeForce GTX 560 Ti, but the product is quite unusual, and deserves some attention. It comes in a big box. Delivery includes: adapter DVI / D-Sub; adapter mini-HDMI/HDMI; two power supply with two 4-pin molex to PCI-E 6-pin; CD with software; instruction. Video card is made in dark colours: PCB and enclosure of cooling system in black. Externally it is very similar to many of other ASUS video cards.



The cooling system is the radiator using three pipes instead of two. Heat pipes have direct contact with the surface of the GPU. They fit tightly in the grooves of the aluminum base. Blowing fan is placed between two raised sections of the radiator. And for a good blow of extreme areas it requires powerful air flow, which means higher fan speed. There is Everflow T129215SU fan with diameter of 92 mm (actual diameter of the blades a little less). The PCB is different from the standard and made in …

This year the Cooler Master company has released a series of original MasterLiquid Pro liquid-cooling systems for Intel and AMD CPUs. The models with 120 mm and 240 mm heat sinks were the first to be released. Now it’s the turn of MasterLiquid Pro 140 and 280 devices, using the liquid-cooling systems heat sinks of the suitable size.



These novelties with a “one-piece” and “two-piece” heat sinks have much in common, though they differ in heat spreader dimensions (171 × 138 × 27 mm and 311 × 138 × 27 mm), as well as in the location of the 140 mm fans pair. MasterLiquid Pro 140 has them mounted on both sides of the heat dissipator and MasterLiquid Pro 280 — on the one side only.


Coolers consist of the big water unit with the inbuilt pump, pipes made out of fluorated ethylene-propylene copolymer in braided cable, the aluminum heat sink and fans with a high static pressure rate (up to 3.15 mm H2O).


The water unit base is manufactured out of copper. Inside of …

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …