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Inajulikana kifaa: 165022367

Mwisho inayojulikana dereva: 23.12.2020

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Chassis Thermaltake Level 10 GT Review

Chassis with futuristic design are not novelty for the exacting consumers, but the demand for such products never slumps. In this light, practically every company that specializes on computer hardware tries to replenish its line of chassis with an item of unusual design and prominent technical characteristics. In the majority of cases, such products belong to the high-end category and cost pretty penny. Thermaltake chassis collection boasts a line of high-end products, among which is Level 10 GT model. This model is characterized by refined and stylish design, as well as, multiple facilities pertained to layout and performance.



Design


Chassis Thermaltake Level 10 GT is developed in Full-Tower form-factor and goes with 582x282x590 dimensions. The frame and plates are made of steel, while the ornamental elements – of plastic. The casing has got external section divisions which are realized by means of the overhung details and different coloring. Upon the whole, this model …

The official announcement of the motherboard Biostar Hi-Fi Z77X

Company Biostar, taking the example of the motherboard market leaders, manufactures the product for the audiophile — Biostar Hi-Fi Z77X. In the latest model are involved: the processor socket LGA1155, the flagship chipset for the platform (Intel Z77), three full-height PCI Express x16 and 13-channel subsystem of CPU power. The developer promises high quality audio through 7.1-channel HD Blue-ray audio codec ALC898, Technology THX TruStudio Pro, Hi-Fi Ground (multi-layer PCB with protectors properties), and Puro Tone (signal / noise ratio — 110 dB), as well as resistors, Hi-Fi Resistor with tin oxide capacitors and Hi-Fi Cap.



Four slots for memory with dual access are designed for installation of modules DDR3-1066/.../2600 totaling 32 GB. In addition, the construction of SLI and CrossFire configurations using the formula «x8 + x8» is possible. The lower slot PCI-E 2.0 x16 x4 is good to use for high-speed SSD-drives, and «external» controllers. PCB has six ports Serial ATA …

Xigmatek Manifests Specifications of Apache III

Xigmatek, a Taiwanese manufacturer of PC cooling solutions, has just promulgated the specifications of its new cooler series entitled Apache III. The series consists of two models only, which differentiate themselves by the casing's material and color. Model CD901 is housed in a silver aluminum casing, while model CD903 – in a black anodized aluminum casing. Both models have been developed specifically for CPU cooling purposes; they are able to support various platforms offered by Intel and AMD: LGA 775, 1155, 1156 (Intel), Socket AM2 and later (AMD).



Both models in Apache III series are equipped with a voluminous aluminum heatsink and 92 mm fan with half-transparent orange ribs. The fan is based on Long Life bearing and features PWM facility that allows for the adjustment of fan rotational speed. The speed span variates between 1200-2500 rpm, depending on the CPU temperature and loading. The noise level does not outreach the measures of twenty dB.


Cooling system Apache …

Samsung Symbian S60 Phone USB Phone Parent Dereva Shusha

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Jina dereva Samsung Symbian S60 Phone USB Phone Parent
Jina la faili 216604_SAMSUNG_USB_Driver_for_Mobile_Phones_x86.exe
Mtengenezaji Samsung
Aina ya kifaa WIRELESS COMMUNICATION DEVICES
Ukubwa 18.5 Mb
Toleo dereva 7.1.30.51
Tarehe dereva 2010-02-05
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Upload tarehe 2016-06-13
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SAMSUNG Mobile Modem Diagnostic Serial Port V2 (VCOMM) SSAECR\{877E4B04-CC61-4F4F-BCFE-5D97750F682E}
SAMSUNG Mobile Modem Diagnostic Serial Port V2 (WDM) SSBCCR\{7F4C6FC5-E92D-4541-9A77-B1F60812369C}
SAMSUNG Mobile Modem V2 SSCDCR\{05D2A0D0-C810-4495-8F97-3BAA1D2871F7}
SAMSUNG Mobile USB DFU2 Device SSCDCR\{72B423D0-02BD-42D9-A594-C84AF3ADBDFA}
SAMSUNG Mobile USB Device SSCECR\{A0C4AA4B-25B9-40B4-95DE-BA1C9612AABE}
SAMSUNG Mobile USB Modem SSCECR\{A2E047C1-BD2C-442F-85D3-80FD512AA86E}
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