Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.



Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.


All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …

Some year-two ago monitors with large 27-inch displays employed only TN+Film panel types. Their price, of course, was not affordable for the entry-level and average customer sectors. But today, 27-inch products are not rarity and, moreover, they are developed also on an advanced AMVA panel type at a more reasonable price. BenQ marveled its customers last summer by the release of an outstanding monitor, codenamed GW2750HM, based exactly on AMVA panel. Its alluring price also added to the product's popularity.



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Monitor BenQ GW2750HM employs AMVA panel (M270HW02 V1), designed by AU Optronics, with W-LED lighting. The latter is called to reduce power consumption and add some neatness to the design. This panel's response time is estimated at 4 ms that is considered to be an optimal index for such type of products. The model features 27-inch display with 1920x1080 resolution, 178/178 viewing angles, 5000:1 static contrast, and 20 million to 1 dynamic contrast. The …

The ADATA company has set before the public its fastest solid-state drive under the XPG SX8200 code name. This device is performed in the M.2 2280 form factor and based on the 2nd generation 3D NAND TLC 64-layer architecture. The novelty got the SMI controller and will be released in 240, 480 and 960 GB variants.

 

XPG SX8200 features excellent performance measures owing to the presence of the PCIe Gen3 x4 interface, the NVMe 1.3 specification and SLC Caching and DRAM Cache Buffer technologies support. These figures, however, depend on the model’s capacity.

 

According to the CrystalDiskMark benchmark the maximum sequential read/write speed reaches 3,200/1,700 MBps. AS SSD Benchmark cites the following speed rates: 2,500/1,600 MBps. At the same time, 4 KB random read/write figures are 310,000/280,000. TBW is 160 TB by the 240 GB model, 320 TB by the 480 GB version and 640 TB be the 960 GB sample.

 
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