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司机的名字 | Acer Android Composite ADB Interface |
文件名 | 259493_USB_Acer_2.0_A50L_A.zip |
供应商 | Acer, Inc. |
驱动型 | ANDROIDUSBDEVICECLASS |
尺寸 | 8.27 Mb |
版本 | 11.0.0000.00000 |
驱动程序日期 | 2015-05-25 |
操作系统 | |
上传 | 2017-04-07 |
Or click to install driver manually | |
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Nowadays compact systems are becoming more widespread, thus increasing the popularity of low-profile cooling systems. Specifically for such systems, the SilverStone Company has designed a low-profile air cooling system under the NT08-115XP codename.
NT08-115XP is announced to be an alternative to a standard cooler out of the CPU supply kit. The manufacturer states, that this cooling system is able to disseminate up to 65 W of heat, so it’s not effective enough to chill down powerfull CPUs.
The dimensions of the SilverStone NT08-115XP cooling system are the following: 101 x 101 x 33 mm. It possesses an aluminum heatsink with a copper center hub. The rotary speed of the 80 mm fan (10 mm thick) is in the range of 1200–3400 rpm, producing an air flow of 5.64–15.98 CFM (9.58–27.15 m3/hr) and a noise level of 16.5–28.98 dBA.
This specialty is compatible with Intel LGA 115x sockets only.
The price has not been voiced yet.