Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.



Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.


The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …

Sapphire Introduces Edgy R9 290 Vapor-X OC Graphics Card

Sapphire Technology Ltd., the first-string supplier of graphics cards based on AMD chips, introduces its proprietary version of Radeon R9 290 adapter – R9 290 Vapor-X OC. As seen from the title, the model features an original Vapor-X cooler with three low-noise fans and has received factory overclocking. Bright design and outstanding performance makes this card a desirable acquirement for enthusiasts and overclockers.



Sapphire R9 290 Vapor-X OC is based on Hawaii PRO GPU (28 nm, GCN architecture) with 2560 stream processors. It runs at 1030 MHz frequency. The chip is accompanied by 4 GB of GDDR5 memory (512-bit interface) that operates at 5600 MHz effective frequency. The card is developed for PCI Express 3.0 x16 rail and is powered through a pair of sockets: 1x 8-pin and 1x 6-pin.


The award-winning Vapor-X cooler consists of an evaporator and five heatpipes. The main heat-pipe features 10 mm diameter, two other – 8 mm, and the last two – 6 mm. This combination is …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.



Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.


According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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Dell Inc. OptiPlex GX620 based on Dell Inc. 0HH807

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