Transcend Information, a leading designer of storage solutions, announces the launch of its new super high-speed SSD, codenamed ESD200. The drive employs the latest USB 3.0 interface of SuperSpeed generation and is distinguished by truly compact dimensions, providing for the most convenient utilization. The casing is void of movable parts and operates with minimum noise level. Besides, it's based on a set of flash chips and owns anti-heat, shockproof and anti-vibratory properties. The series will be introduced by models of 128GB and 256GB volume capacity.



The implementation of SuperSpeed USB 3.0 interface ensures ten times faster data transfer speed, if compared with the previous USB 2.0 generation. On such conditions, Transcend ESD200 is capable to develop Read speed up to 260 Mb/sec and Write speed up to 225 Mb/sec. This implies that 4.7GB DVD drive full of different content will be copied for fifteen seconds only. However, a new SSD is backwards compatible with USB 2.0; so, …

Not so long ago Full HD monitors have been considered a kind of miracle, providing the utmost graphic facilities. This format is nowadays actively implemented in the product lines of many manufacturers, though the price for monitors with Full HD resolution is still biting. Despite this fact, some users feel an acute need for even higher resolution, so I-O Data, a Japanese designer of PC hardware, announced the release of a model with the maximal possible resolution.



Codenamed LCD-MF271CGBR, the monitor features 2560x1440 resolution and 27-inch display. The working display space exceeds the one implemented in monitors with Full HD resolution in 1.8 times. Such specifications offer unmatched graphics effects for the successful accomplishment on rather demanding conditions.


Monitor I-O Data LCD-MF271CGBR is based on IPS array type and is characterized by the following features:

— available video outputs: dual DVI-D, HDMI, DisplayPort, VGA;

— maximal supported …

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …