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Познати уреди:165022367

Последната позната возач: 23.12.2020

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Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.



Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.


According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …

Intel Unveils Power-Saving Silvermont Architecture

Intel has just unveiled its new advanced working out: power-saving and high-efficient microarchitecture codenamed Silvermont. According to Intel, this architecture is primarily targeting devices with low power consumption and can embrace a vast production segment, starting from smartphones and finishing with datacenters. Silvermont is ready to demonstrate a threefold increase of performance and fivefold decrease of power consumption (with preservation of erstwhile efficiency), if compared with the current generation of Intel Atom cores.



Intel Silvermont has been elaborated in compliance with the norms of 22 nm technological process with the implementation of 3-D Tri-Gate transistors. The employment of new progressive techniques promotes for enhancing the operation speed and reducing energy demand of products which use Silvermont as the basis. Multi-core architecture with the support of up to eight cores ensures higher bandwidth, lower latency and more efficient operation on …

An All-new Series of Super Flower Power Supply Units Is Introduced by 10 Devices of 400–850 W Capacity

The Super Flower Co. is widely known by virtue of its 80Plus Titanium power modules. At present this manufacturer is going to present a cutting-edge series of low-profile devices.



The latest line will include ten power supplies, the capacity of which varies in the range of 400–850 W depending on the model. Those of them providing 750 W and more will get partially detachable cables.


Being optimized by Super Flower professionals, the topological layout of these Super Flower products is based on the two-transistor forward converter. PWM and PFC schemes are designed with a Fairchild controller and Infineon field-effect transistors. Hardware components also incorporate STMicroelectronics and Mospec diodes, a Fujitsu relay and a Teapo electrolytic capacitor.


All models of this series are intended for Super Flower OEM customers and comply with 80Plus Bronze standards.

на MTP Возачот Преземете

MTP за Windows XP x64, Windows XP,

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Возачот име MTP
Име на датотека 239144_HiSuite-1.6.10.08-AndroidJinn.zip
Да Huawei Incorporated
Уред Тип WPD
Големина 27.6 Mb
Возач верзија 1.02.00.00
Driver Date 2012-01-02
Оперативен систем Windows XP x64, Windows XP,
Upload 2016-11-28
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Симнете бесплатно возачот на MTP Windows XP x64, Windows XP,

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[-] Уреди Поддржано

Android ADB Interface USB\CLASS_E0&SUBCLASS_01&PROT_03
Android Adapter ADB Interface USB\VID_12D1&PID_1010&MI_00
Android Adapter ADB Interface (for Logo Test) USB\VID_12D1&PID_1010&MI_01
Android Adapter Modem USB\VID_12D1&PID_1010&MI_02
Android Adapter Modem (for Logo Test) USB\VID_12D1&PID_1011&MI_00
Android Adapter PCUI USB\VID_12D1&PID_1011&MI_01
Android Adapter PCUI (for Logo Test) USB\VID_12D1&PID_101D&MI_00
Android Bootloader Interface USB\VID_12D1&PID_101D&MI_01
Android Composite ADB Interface USB\VID_12D1&PID_101D&MI_02
Android Single ADB Interface USB\VID_12D1&PID_101E&MI_00
DBAdapter - Modem USB\VID_12D1&PID_101E&MI_01
DBAdapter - PC UI Interface USB\VID_12D1&PID_1030
DBAdapter - Reserved Interface USB\VID_12D1&PID_1031
DBAdapter Reserved Interface USB\VID_12D1&PID_1032&MI_00
DBConsole Reserved Interface USB\VID_12D1&PID_1032&MI_01
HUAWEI CDMA Handset - Application Interface USB\VID_12D1&PID_1032&MI_03
HUAWEI CDMA Handset - Modem USB\VID_12D1&PID_1032&MI_04
HUAWEI CDMA Handset - NMEA USB\VID_12D1&PID_1033&MI_00
HUAWEI FP Handset - Modem USB\VID_12D1&PID_1033&MI_01
HUAWEI FP Handset - NMEA USB\VID_12D1&PID_1033&MI_03
HUAWEI FP Handset - PC UI Interface USB\VID_12D1&PID_1033&MI_04
Huawei HandSet Connect - USB Device USB\VID_12D1&PID_1034&MI_00
MTP USB\VID_12D1&PID_1034&MI_01
Mobile Adapter - ETS Application Interface USB\VID_12D1&PID_1034&MI_03
Mobile Adapter - ETS Modem USB\VID_12D1&PID_1034&MI_04
Mobile Adapter - ETS PC UI Interface USB\VID_12D1&PID_1034&MI_05
Mobile Adapter - Modem USB\VID_12D1&PID_1035&MI_00
Mobile Adapter - PC UI Interface USB\VID_12D1&PID_1035&MI_01
Mobile Connect - USB Device USB\VID_12D1&PID_1035&MI_03
T-Mobile 3G Phone ADB Interface USB\VID_12D1&PID_1035&MI_04
T-Mobile 3G Phone ADB Interface (for Logo Test) USB\VID_12D1&PID_1035&MI_05
T-Mobile 3G Phone Modem USB\VID_12D1&PID_1038&MI_01
T-Mobile 3G Phone Modem (for Logo Test) USB\VID_12D1&PID_103A
T-Mobile 3G Phone PCUI USB\VID_12D1&PID_1050&MI_02
T-Mobile 3G Phone PCUI (for Logo Test) USB\VID_12D1&PID_1051
T-Mobile Mobile Connect - USB Device USB\VID_12D1&PID_1052&MI_00
Windows Mobile-based Internet Sharing Device USB\VID_12D1&PID_1052&MI_01