The Forthcoming Switch to 5 mm HDD Models

Nowadays HDD segment is represented by various products from various companies. However, with the development and release of ultrabooks, manufacturers directed their production to the hybrid-type drives. This resulted in the predominance of hybrid solutions in the market.



Recently Itel has advanced a motion to digress somehow from the production of hybrid drives and switch to the decrease of traditional HDDs dimensions to 5 mm in casing depth. According to the company's assumptions, such change could moderate the price for drives and provide the necessary volume capacity for ultrabooks.


Some manufacturers have already directed a part of their technological powers to the design of HDDs with 5 mm casings. Nevertheless, there appeared a couple of obstacles on their way: the necessity to stabilize data reading and writing activities, and increase of costs spent on drives' production. This will result in the rise of end price.


IT professionals and analysts forecast the …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Dell Inc. Latitude D620 based on Dell Inc. 0KX350

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